Taconic

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136 Coonbrook Road
Petersburgh, NY 12138-4303
About Taconic
  • Taconic offers a wide range of high frequency laminates and prepregs used for fabrication of antennas, multilayer RF and high speed digital boards, interconnections and devices. Unique materials include low-loss prepregs, microwave laminates designed for low moisture and solvent resistance to enhance performance in difficult environments, and low-loss flexible laminates.
Competitors of Taconic
  • CoorsTek

    CoorsTek is a leading international supplier of engineered technical ceramics. Utilizing over 300 advanced ceramic formulations, CoorsTek manufactures devices and components for virtually every industry in the global marketplace, including medical, electronics, and semiconductor. CoorsTek...
  • AVX Corporation

    AVX Corporation is a leading international supplier of electronic passive components and interconnect solutions with 26 manufacturing and customer support facilities in 15 countries around the world. AVX offers a broad range of devices including capacitors, resistors, filters, timing and circuit...
  • Skyworks

    Skyworks has been enabling wireless connectivity for over a decade, but as the Internet of Things (IoT) expands the way consumers manage information and their environment, there is a growing need for new solutions. Skyworks’ product portfolio is continuing to enable the needs of every emerging...
Products by Taconic
  • fastRise(TM)

    Multilayer non-reinforced prepreg designed to eliminate skew in differential transmission lines and eliminate Dk fluctuations caused by fiberglass in filter and coupler applications. fR-27 is a low temperature alternative to thermoplastic films in military designs. Read more
  • TSM-DS

    TSM-DS is a thermally stable, industry leading low loss core that can be manufactured with the predictability and consistency of the best fiberglass reinforced epoxies. Other features of this dimensionally stable laminate include industry best Df at .0010 @ 10 GHz, low (~5%) fiberglass content,... Read more
  • fastFilm Laser Ablatable Chip Packaging Substrate

    fastFilm 29 is a thin, laser ablatable substrate consisting of PTFE and a high concentration of ceramic. The very low 20 ppm/C Z axis expansion creates a reliable substrate for chip packaging. This non-reinforced core material is very homogeneous and suited for RF and digital applications which... Read more