Taconic

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136 Coonbrook Road
Petersburgh, NY 12138-4303
About Taconic
  • Taconic offers a wide range of high frequency laminates and prepregs used for fabrication of antennas, multilayer RF and high speed digital boards, interconnections and devices. Unique materials include low-loss prepregs, microwave laminates designed for low moisture and solvent resistance to enhance performance in difficult environments, and low-loss flexible laminates.
Competitors of Taconic
  • American Standard Circuits, Inc.

    ASC understands your technical challenges. Whether you need quick prototypes, a cost effective solution for your flex, rigid-flex, mixed dielectrics or our metal clad PCB’s , we have the experience, the people and the technology to meet these challenges. We compete in time and must go beyond our... Read More
  • American Technical Ceramics

    ATC designs, develops, manufactures and markets Multilayer Capacitors, Single Layer Capacitors, Resistive Products, Inductors and Custom Thin Film Products for RF, microwave and millimeter-wave applications. Our products are primarily focused on the wireless communications infrastructure, fiber...
  • CoorsTek

    CoorsTek is a leading international supplier of engineered technical ceramics. Utilizing over 300 advanced ceramic formulations, CoorsTek manufactures devices and components for virtually every industry in the global marketplace, including medical, electronics, and semiconductor. CoorsTek...
Products by Taconic
  • fastRise(TM)

    Multilayer non-reinforced prepreg designed to eliminate skew in differential transmission lines and eliminate Dk fluctuations caused by fiberglass in filter and coupler applications. fR-27 is a low temperature alternative to thermoplastic films in military designs. Read more
  • TSM-DS

    TSM-DS is a thermally stable, industry leading low loss core that can be manufactured with the predictability and consistency of the best fiberglass reinforced epoxies. Other features of this dimensionally stable laminate include industry best Df at .0010 @ 10 GHz, low (~5%) fiberglass content,... Read more
  • fastFilm Laser Ablatable Chip Packaging Substrate

    fastFilm 29 is a thin, laser ablatable substrate consisting of PTFE and a high concentration of ceramic. The very low 20 ppm/C Z axis expansion creates a reliable substrate for chip packaging. This non-reinforced core material is very homogeneous and suited for RF and digital applications which... Read more